Litšobotsi tse leshome tse ntle ka ho fetesisa tsa theknoloji ea vacuum sputtering coating.

Sepheo sa sputtering ke thepa ea bohlokoa ea ho roala ka vacuum
Ho roala ha sputtering ho bolela mohloli oa thepa o lokelang ho qoelisoa (o bitsoang target) le matrix hammoho ka kamoreng ea vacuum, ebe o sebelisa bombardment e ntle ea ion e le sepheo sa cathode, e le hore liathomo le limolek'hule tse ho shebiloeng li balehe 'me li fetohe filimi. ka holim'a matrix.

Litšobotsi tse leshome tsa mokhoa oa ho roala sputtering

1. E ka lokisoa ka sepheo sa mefuta eohle ea thepa e ka sebelisoang e le lisebelisoa tsa filimi, ho kenyelletsa le mefuta eohle ea tšepe, semiconductor, lisebelisoa tsa ferromagnetic, hammoho le li-oxide tse sireletsang, li-ceramics, li-polymers le lintho tse ling, haholo-holo tse loketseng ntlha e phahameng ea ho qhibiliha. le tlaase mouoane khatello ea thepa deposition barbotage;
2. Tlas'a maemo a loketseng a multiple target co-sputtering mode, e ka kenya likarolo tse hlokahalang tsa motsoako, filimi e kopantsoeng;
3. Eketsa oksijene, naetrojene kapa khase e 'ngoe e sebetsang moeeng oa ho ntša metsi a sputtering, e ka kenngoa ho etsa filimi e kopantsoeng ea lintho tse lebisitsoeng le limolek'hule tsa khase;
4. Laola khatello ka kamoreng ea vacuum, matla a sputtering, ha e le hantle a ka fumana sekhahla se tsitsitseng sa deposition, ka ho laola ka nepo nako ea ho roala, ho le bonolo ho fumana junifomo e phahameng ka ho nepahetseng filimi botenya, le ho pheta-pheta hantle;
5. Bakeng sa ho roala sebakeng se seholo, sputtering deposition e phahametse ka ho feletseng ho feta mokhoa o mong oa ho roala;
6. Ka setsing sa vacuum, likaroloana tsa sputtering ha li amehe ke matla a khoheli, 'me boemo ba sepheo le substrate bo ka tsamaisana ka bolokolohi;
7. Sputtering likaroloana hoo e ka bang ha a susumetsoa ke matla a khoheli, lintho tse shebiloeng le sebaka sa substrate mahala tokisetso: substrate le adhesion matla a lera hangata mouoane barbotage ka makhetlo a fetang 10, 'me ka lebaka la sputtering likaroloana le matla a phahameng, ka holim'a filimi. tla tsoela pele ho ka thata le le letso-letso lera holim'a diffusion, le matla a phahameng etsa substrate nako e telele e le mocheso tlaase crystallization lera ka ba;
8. Boima bo phahameng ba nucleation qalong ea ho thehoa ha filimi, filimi e tšesaane haholo e tsoelang pele e ka tlaase ho 10nm;
9. Sputtering target lintho tse bonahalang bophelo ba nako e telele tšebeletso, e ka ba nako e telele tsoelang pele tlhahiso;
10. Sepheo sa sputtering se ka etsoa ka libopeho tse sa tšoaneng.Mokhoa oa ho fafatsa o ka laoloa hamolemonyana 'me katleho ea ho fafatsa e ka ntlafatsoa ka katleho ka moralo o khethehileng oa sebopeho sa sepheo.
Lintlha tse ka holimo ke litšobotsi tse leshome tsa theknoloji ea magnetron sputtering, empa ho boetse ho na le mathata a mang a lokelang ho ntlafatsoa ka ho eketsehileng.E 'ngoe ea mathata a mantlha ke hore sekhahla sa ts'ebeliso ea thepa e shebiloeng e hloka ho ntlafatsoa.Ha e le hantle, sekhahla sa ts'ebeliso ea sepheo sa circular planar cathode hangata se ka tlase ho 30%.Sekhahla sa tšebeliso ea thepa e shebiloeng e ka ntlafatsoa ka ho ntlafatsa moralo oa matla a khoheli.Ho phaella moo, tekanyo ea tšebeliso ea thepa e pota-potileng e phahameng, e ka fihlang ho feta 70% -80%.


Nako ea poso: Aug-20-2022